With the continuous evolution of 5G technologies and the exploration of new possibilities for 6G, the challenges posed by operating at extremely high frequencies are becoming more apparent. Scientists and engineers are faced with issues such as signal attenuation, interference, and maintaining signal integrity. In the pursuit of solutions for these challenges, researchers are turning to insulating materials with exceptional dielectric properties, such as polyimides (PIs).
A research team from the Tokyo Institute of Technology, led by Professor Shinji Ando, conducted a study on the dielectric properties of 11 PIs with different molecular structures. The research, published in Applied Physics Letters, aimed to bridge the knowledge gap in understanding the correlation between the molecular structure of PIs and their dielectric properties, particularly in the higher frequency range of 110–330 GHz.
Using a Fabry–Pérot resonator, the researchers measured the dielectric constant (Dk) and dissipation factor (Df) of the PIs. The study revealed that PIs with higher fluorine content exhibited lower Dk values, with a perfluorinated polyimide showing significantly lower Dk and smaller Df compared to other PIs. Additionally, the increase in Df was found to be negatively correlated with the polar fraction of the PIs.
The findings of this study have significant implications for the development of high-performance polymer-based insulating materials for 6G technologies. By gaining a better understanding of the dielectric properties of PIs at high frequencies, engineers may be able to overcome the challenges associated with operating in the terahertz range, paving the way for faster and more reliable telecommunications.
While the study sheds light on the potential of PIs for 6G technologies, further research and efforts are required to identify the optimal type of PIs for practical applications. Spectroscopic studies in the terahertz range may provide additional insights into the dielectric responses of different structural PIs, facilitating the development of advanced insulating materials for future telecommunications systems.
The study on polyimides offers promising prospects for the use of polymeric materials in 6G technologies. By unraveling the dielectric properties of PIs at high frequencies, researchers are paving the way for innovations that could enhance the performance and reliability of next-generation wireless communications systems.