The realm of biomechanical sensing is on the verge of a groundbreaking transformation with the development of flexible, modular tactile sensors. A recent study conducted by researchers from Peking University has unveiled a cutting-edge technology that could revolutionize the way we detect and monitor biomechanical signals from the human body. By incorporating 3D micro strain gauges into tactile sensors, the researchers have opened up a world of possibilities in high-density pressure mapping, wireless monitoring of biomechanical signals, and decoupled measurement of temperature, normal force, and shear force.
Han Mengdi, the corresponding author of the study, highlights the innovative nature of 3D micro strain gauges in expanding the sensing modality of tactile sensors. These strain gauges offer a versatile platform for developing flexible tactile sensors and electronic skins, pushing the boundaries of traditional planar sensors. Through a process compatible with lithographic techniques, the researchers were able to enhance spatial density in tactile sensing, paving the way for advanced customization and performance optimization.
The potential of 3D micro strain gauges lies in their ability to be tailored to specific sensing requirements. Chen Xu, a Ph.D. student in Han’s lab, emphasizes the ease of customizing sensor performance by adjusting the structural parameters of the strain gauges. By fine-tuning the shape of the 3D microstructure, the thickness of each layer of the thin film, and the encapsulating polymer, the sensitivity and other properties of the tactile sensor can be seamlessly modified. This level of customization lays a solid foundation for creating flexible sensors that cater to a wide range of applications.
Each flexible sensor equipped with four 3D micro strain gauges brings precision and versatility to biomechanical sensing. By orienting the strain gauges orthogonally, the sensor enables accurate decoupling of normal force and shear force, allowing for the precise determination of external forces’ direction and magnitude. Additionally, the incorporation of a temperature sensing module adds another layer of functionality to the sensor, enhancing its capability to capture diverse biomechanical signals. Yiran Wang, another Ph.D. student in Han’s lab, emphasizes the significance of an anti-crosstalk circuit in supporting the spatiotemporal mapping of forces, showcasing the sensor’s wide applicability in various fields.
The compatibility of 3D micro strain gauges with both microelectronics and macroelectronics opens up a multitude of opportunities for interdisciplinary applications. From robotics to biomedicine and consumer electronics, these strain gauges offer a versatile solution for enhancing sensing performance and integration. The seamless integration of the strain gauges with existing microfabrication processes ensures scalability and mass processing capabilities, making them a promising technology for future applications in microelectronics and beyond.
The advent of 3D micro strain gauges represents a significant advancement in the field of biomechanical sensing. By leveraging the unique properties of these strain gauges, researchers have developed a flexible and customizable sensing platform that holds immense potential for various industries. The innovative approach showcased in this study not only enhances the performance of tactile sensors but also expands the horizons of microelectronics and microelectronics. As we move towards a future driven by technological advancements, the integration of 3D micro strain gauges into flexible tactile sensors heralds a new era of precision sensing and integration solutions.